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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 資訊工程學系 > 期刊論文 >  2001 needs for multi-level interconnect technology

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/12707

    Title: 2001 needs for multi-level interconnect technology
    Authors: Soo-Young Oh
    Keh-Jeng Chang
    Date: 1995
    Publisher: Institute of Electrical and Electronics Engineers Inc
    Keywords: ULSI
    circuit CAD
    integrated circuit design
    integrated circuit interconnections
    integrated circuit metallisation
    Abstract: Looks at the materials and thermal alternatives for scaled, next-century VLSI/ULSI interconnects. It is shown that ad hoc executions of programs to calculate interconnect parameters for VLSI/ULSI design and analysis are too time-consuming to be practical. The tool used in this study to model a hypothetical interconnect system was Hewlett Packard's HTVE (HP Interconnect Value Extractor)
    Relation Link: http://www.ieee.org/portal/site
    URI: http://nthur.lib.nthu.edu.tw/handle/987654321/12707
    Appears in Collections:[資訊工程學系] 期刊論文
    [資訊工程學系] 期刊論文

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