National Tsing Hua University Institutional Repository:2001 needs for multi-level interconnect technology
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    Title: 2001 needs for multi-level interconnect technology
    Authors: Soo-Young Oh
    Keh-Jeng Chang
    Date: 1995
    Publisher: Institute of Electrical and Electronics Engineers Inc
    Keywords: ULSI
    circuit CAD
    integrated circuit design
    integrated circuit interconnections
    integrated circuit metallisation
    Abstract: Looks at the materials and thermal alternatives for scaled, next-century VLSI/ULSI interconnects. It is shown that ad hoc executions of programs to calculate interconnect parameters for VLSI/ULSI design and analysis are too time-consuming to be practical. The tool used in this study to model a hypothetical interconnect system was Hewlett Packard's HTVE (HP Interconnect Value Extractor)
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    Appears in Collections:[Department of Computer Science] CS Journal / Magazine Articles
    [Department of Computer Science] CS Journal / Magazine Articles

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