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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 會議論文  >  Aluminum thermomigration technology for 3-dimensional integrated circuits

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/13069

    Title: Aluminum thermomigration technology for 3-dimensional integrated circuits
    Authors: Lee, J.Y.M.
    Brown, R.H.
    Etchells, R.D.
    Grinberg, J.
    Nudd, G.R.
    Nygaard, P.A.
    Date: 1981
    Publisher: Institute of Electrical and Electronics Engineers Inc.
    Keywords: Aluminum thermomigration technology
    integrated circuits
    Relation Link: Electron Devices Meeting, 1981 International, Publication Date: 1981, Volume: 27 , On page(s): 66 - 66
    URI: http://nthur.lib.nthu.edu.tw/handle/987654321/13069
    Appears in Collections:[電機工程學系] 會議論文
    [電子工程研究所] 會議論文

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