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    National Tsing Hua University Institutional Repository > 工學院  > 工業工程與工程管理學系 > 期刊論文 >  Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/36613

    Title: Analysing inspection frequency for wafer bumping process and an empirical study of UNISON decision framework
    Authors: Chen-Fu Chien;Chin-Han Hu;Chi-Yung Lin
    教師: 簡禎富
    Date: 2008
    Publisher: Inderscience
    Relation: International Journal of Manufacturing Technology and Management, Volume 14, Issue 1-2, 2008, Pages 130-144
    Keywords: decision analysis
    inspection frequency
    wafer bumping
    risk analysis
    quality engineering
    UNISON decision
    wafer fabrication
    Abstract: © 2008 Inderscience - This study aims to develop a UNISON decision framework for analysing the inspection frequency decisions for the advanced wafer bumping process. Since the accumulated values of the wafers fabricated in wafer fabs are high, process excursion and defects in bumping will cause serious loss. Thus, it is critical to determine the inspection frequency to fulfil the requirement of mass production while ensuring the yield. For validation, an empirical study was conducted in a bumping company and the results showed practical viability of the proposed approach.
    URI: http://www.inderscience.com/
    Appears in Collections:[工業工程與工程管理學系] 期刊論文

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