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    National Tsing Hua University Institutional Repository > 工學院  > 工業工程與工程管理學系 > 會議論文  >  Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/46420


    Title: Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
    Authors: Chen-Fu Chien;Chia-Yu Hsu;Hong-Shing Chou;Chih-Wei Lin
    教師: 簡禎富
    Date: 2006
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE International Symposium on Semiconductor Manufacturing, 2006. ISSM 2006, 25-27 Sept. 2006, pages 317-320
    Keywords: productivity
    semiconductor device manufacture
    standards
    Abstract: Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor manufacturing. However, little research has been done to address productivity from the perspective of wafer exposure performance. This study aims to propose a novel standard, overall wafer effectiveness (OWE), to evaluate the effectiveness of wafer exposure rather than only considering tool productivity. Furthermore, the proposed OWE can be easily extended to incorporate additional attributes such as throughput, yield, and price. In particular, a weighted OWE that integrates mask field utilization and OWE is illustrated with numerical example to show the practical viability of OWE as a semiconductor industry standard to drive collaborative efforts among IC designers, equipment vendors, and manufacturers for enhancing total wafer effectiveness.
    URI: http://www.ieee.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/46420
    Appears in Collections:[工業工程與工程管理學系] 會議論文

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