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    National Tsing Hua University Institutional Repository > 原子科學院  > 工程與系統科學系 > 會議論文  >  EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3-D microstructures

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47211

    Title: EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3-D microstructures
    Authors: Cohen, Adam;Frodis, Uri;Tseng, Fan-Gang;Zhang, Gang;Mansfeld, Florian;Will, Peter
    教師: 曾繁根
    Date: 1999
    Publisher: International Society for Optical Engineering
    Relation: Proc. SPIE, International Society for Optical Engineering, Vol. 3874, 1999, Pages 236
    Keywords: EFAB
    Electrochemical FABrication
    Abstract: EFAB ('Electrochemical FABrication') is a new micromachining process promising to rapidly and automatically batch fabricate high-aspect-ratio microstructures with arbitrary 3-D geometry using inexpensive equipment. Conventional microfabrication processes have so far produced fairly simple geometries (e.g., 1-5 structural layers), yet many MEMS could benefit if more sophisticated shapes could be manufactured. By using 'Instant Masking' (IM)-a novel in-situ micropatterning method-to simplify, accelerate, and automate through-mask electroplating, EFAB can produce extremely complex shapes by depositing hundreds-thousands of layers at high speed. While other processes often do not allow integration with ICs, EFAB operates at less than 60°C, making IC compatibility a possibility. Alternative processes require costly facilities and equipment; EFAB separates photolithography from device fabrication, requiring a cleanroom only for mask-making, then depositing all layers in a low-cost, self-contained machine. All Instant Masks required can be prepared simultaneously, without repeating the lithography on each layer. Selective electrodeposition requires simply mating the mask with the substrate and applying current; in this way we have patterned well-defined features as small as 20 × 20 µm. The procedures in EFAB are selective electrodeposition, blanket electrodeposition, and planarization. To date we have built metal structures with up to 12 layers consisting of independently-moving components.
    URI: http://spie.org/
    Appears in Collections:[工程與系統科學系] 會議論文

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