National Tsing Hua University Institutional Repository:Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system at 240 °C
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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system at 240 °C


    题名: Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system at 240 °;C
    作者: Li,Chia-Ying;Duh,Jenq-Gong
    教師: 杜正恭
    日期: 2005
    出版者: Materials Research Society
    關聯: Journal of Materials Research, 20[11] (2005) pp. 3118-3124
    关键词: Morphology
    Scanning electron microscopy
    Phase interfaces
    Phase diagrams
    Phase transitions
    Interfacial energy
    Tin alloys
    Ternary systems
    Phase equilibria
    摘要: The interfacial reactions between solders and under bump metallization (UBM) have been of great interest recently in flip chip technology. Intermetallic compounds (IMCs), i.e., (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4, usually formed between solders and UBM. To fully understand the interfacial reactions and phase transformation phenomenon, a suitable phase diagram concerning solders, IMCs, and UBM materials is required. In particular, a Sn-rich phase region in the Sn-Cu-Ni ternary diagram is very critical in determining the concentration tendency of x and y values in (Ni1-x, Cux)3Sn4 and (Cu1-y, Niy)6Sn5 compounds. In this study, ternary Sn-Cu-Ni alloys were prepared and annealed at 240 °C. Three equilibrium phases, Sn, Ni3Sn4, and Cu6Sn5, were identified by x-ray diffraction analysis and also showed in backscattered electron imaging. Using electron probe microanalysis quantitative analysis, three acme compositions of the ternary region in the Sn-Cu-Ni isotherm near the Sn-rich corner were determined as 98.5 at. % Sn, (Ni0.80, Cu0.20)3Sn4 and (Cu0.59, Ni0.41)6Sn5. In addition, the solubility of Cu and Ni in (Ni,Cu)3Sn4 and (Cu,Ni)6 Sn5 compounds was evaluated. Finally, the isothermal section of the ternary Sn-Cu-Ni system at 240 °C was proposed on the basis of experimental results in this study.
    显示于类别:[材料科學工程學系] 期刊論文


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