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    National Tsing Hua University Institutional Repository > 理學院 > 物理系 > 期刊論文 >  AC power loss and signal coupling in very large scale integration backend interconnects


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/56128


    Title: AC power loss and signal coupling in very large scale integration backend interconnects
    Authors: Chen CC;Kao HL;Liao CC;Chin A;McAlister SP;Chi CC
    教師: 齊正中
    Date: 2006
    Publisher: Japanese Journal of Applied Physics
    Relation: JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, Japanese Journal of Applied Physics, Volume 45, Issue 4B, 2006, Pages 2992-2996
    Keywords: AC power
    interconnect
    RF
    Si
    3D
    Abstract: Both the coupling and AC power losses in integrated circuit interconnects in the radio-frequency regime have been measured. The AC power loss decreases with decreasing length, decreasing spacing, and increasing inter metal dielectric (IMD) thickness of parallel metal lines. The unwanted signal coupling and cross-talk monotonically decrease with increasing spacing and decreasing length of the parallel metal lines. However, increasing the IMD thickness from 0.7 to 6 mu m improves the low frequency performance but not the maximum operation frequency. Using a high-resistivity Si (HRS) substrate the AC power loss is significantly reduced but is traded off with an increase in coupling loss. The most effective method of reducing both the AC power and coupling losses is the combined use of three dimensional (3D) integration and an HRS, which gives larger than 1-2 orders of magnitude improvement, up to 20 GHz.
    URI: http://jjap.ipap.jp/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/56128
    Appears in Collections:[物理系] 期刊論文

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