English  |  正體中文  |  简体中文  |  Items with full text/Total items : 54367/62174 (87%)
Visitors : 14411115      Online Users : 37
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Analyses of mode I edge delamination by thermal stresses in multilayer systems

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/62156

    Title: Analyses of mode I edge delamination by thermal stresses in multilayer systems
    Authors: Hsueh, Chun-Hway;Lee, Sanboh;Lin, Hung-Yi
    教師: 李三保
    Date: 2006
    Publisher: Elsevier
    Relation: Composites Part B: Engineering
    Volume 37, Issue 1, January 2006, Pages 1-9
    Keywords: Layered structures
    Residual stress
    Analytical modelling
    Abstract: Multilayer systems are generally subjected to thermal stresses because of the thermal mismatch between layers, and localized stresses normal to interfaces; i.e., interfacial peeling stresses, exist at edges because of the free-edge effect. These peeling stresses can result in mode I edge delamination. However, because of the complexity of the problem, exact closed-form solutions for peeling stresses are unattainable, even for bilayer systems. As a result, the peeling moment resulting from these localized peeling stresses was proposed recently as an alternative to study edge delamination. Exact closed-form solutions for the peeling moment at each interface in multilayer systems are derived in the present study, and approximate solutions for the special case of multilayer of thin films on a thick substrate are also presented. Specific results are calculated for GaAs/Si bilayers and GaP/GaAs0.5P0.5/GaAs trilayers. However, the present solutions are readily to be applied to any elastic multilayer system for characterizing mode I edge delamination by thermal stresses.
    URI: http://www.elsevier.com/
    Appears in Collections:[材料科學工程學系] 期刊論文

    Files in This Item:

    File Description SizeFormat
    2020330010011.pdf398KbAdobe PDF566View/Open


    SFX Query


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback