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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 會議論文  >  The Study of Cu/hydrogen silsesquioxane Interconnects Fabricated by Hot-embossing

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/70088

    Title: The Study of Cu/hydrogen silsesquioxane Interconnects Fabricated by Hot-embossing
    Authors: Chih-Chieh Hsu;Li-Wei Cheng;Fon-Shan Huang
    教師: 葉鳳生
    Date: 2009
    Publisher: Materials Research Society
    Relation: 2009 Materials Research Society spring meeting, San Francisco, CA., U.S.A, April 13-17, 2009
    Keywords: Cu/hydrogen
    Relation Link: http://www.mrs.org/home/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/70088
    Appears in Collections:[電機工程學系] 會議論文

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