National Tsing Hua University Institutional Repository:Very Low Temperature Polycrystalline Silicon Films with Very Large Grains Deposited for Thin Film Transistors Application
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    NTHUR > College of Electrical Engineering and Computer Science > Department of Electrical Engineering > EE Journal / Magazine Articles  >  Very Low Temperature Polycrystalline Silicon Films with Very Large Grains Deposited for Thin Film Transistors Application


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/72442


    Title: Very Low Temperature Polycrystalline Silicon Films with Very Large Grains Deposited for Thin Film Transistors Application
    Authors: K.C. Wang;T.R. Yew;H.L.Hwang
    Teacher: 黃惠良
    Date: 1996
    Publisher: Elsevier
    Relation: Applied Surface Science, Elsevier, Volume 92, Issue 1-4, Feb 2 1996, Pages 99-1054
    Keywords: Chemical vapor deposition
    Low temperature operations
    Passivation
    Abstract: This paper presents the results of low temperature polycrystalline silicon growth on SiO2 and glass substrates. The silicon films were deposited with the hydrogen dilution method by electron cyclotron resonance chemical vapor deposition at or below 250°C without any thermal annealing. Hydrogen passivation of the SiO2 surface was applied to enhance the grain growth of poly-Si deposition. The polycrystallinity of the silicon films was established by transmission electron microscopy (TEM), Raman scattering, and X-ray diffraction. The maximum grain size was about 1 μm. The crystalline fraction of the polycrystalline silicon (poly-Si) films was near 100% as identified by Raman shift spectra. The preferred orientations of the poly-Si film were 〈110〉 and 〈111〉. Poly-Si films with a maximum grain size of 7000 angstrom were formed at a substrate temperature as low as 100°C
    Relation Link: http://www.elsevier.com/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/72442
    Appears in Collections:[Department of Electrical Engineering] EE Journal / Magazine Articles

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