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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 期刊論文 >  Monolithic integration of two-dimensional transverse multimode interference couplers and silicon photonic wires

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83589

    Title: Monolithic integration of two-dimensional transverse multimode interference couplers and silicon photonic wires
    Authors: Wei-Chao Chiu;Cheng-Yen Lu;Ming-Chang M. Lee
    教師: 李明昌
    Date: 2011
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE Journal of Selected Topics in Quantum Electronics, Institute of Electrical and Electronics Engineers, Volume 17, Issue 3, 2011, May, Pages 540-545
    Abstract: A new technology using hydrogen annealing and thermal oxidation is proposed to fabricate a very compact 2-D multimode interference coupler monolithically integrated with two-layer silicon photonic wires. Two devices, a 1 × 1 cross-power coupler and a 1 × 22 power splitter, are presented and characterized. The experimental result shows that a 3-dB transmission bandwidth of 1.1 nm, and the on-chip coupler losses of 8.6 dB and 2.84 dB were accomplished for the 1 × 1 cross-power coupler and the 1 × 22 power splitter. This paper demonstrates the possibility of realizing 3-D photonic integration for silicon-on-insulator lightwave circuits.
    Relation Link: http://www.ieee.org/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83589
    Appears in Collections:[電機工程學系] 期刊論文
    [奈微與材料科技中心] 期刊論文
    [光電工程研究所] 期刊論文
    [奈米工程與微系統研究所] 期刊論文

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