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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 期刊論文 >  Three dimensional photoacoustic imaging by a CMOS micromachined capacitive ultrasonic sensor


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83599


    Title: Three dimensional photoacoustic imaging by a CMOS micromachined capacitive ultrasonic sensor
    Authors: Meng-Lin Li;P.-H. Wang;P.-L. Liao;M. S.-C. Lu
    教師: 李夢麟
    Date: 2011
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE ELECTRON DEVICE LETTERS, Institute of Electrical and Electronics Engineers, Volume 32, Issue 8, AUG 2011, Pages 1149-1151
    Keywords: Capacitive sensors
    CMOS technology
    microelectromechanical systems (MEMS)
    photoacoustic imaging
    Abstract: In this letter, we demonstrate the feasibility of 3-D photoacoustic imaging using a monolithic CMOS micromachined capacitive ultrasonic sensor. The sensing membranes are released by a post-CMOS metal etch and sealed by silicon dioxide. Nine membranes, each with an inner diameter of 60 mu m, form a single detection unit with a capacitance value of 292.5 fF. A 6-mu m carbon fiber was employed to evaluate the 3-D photoacoustic imaging capability and resolution of our sensor. A 2-D large-aperture array was emulated by 2-D mechanical scanning of a single sensing element with a scanning step of 120 mu m. A 2-D synthetic aperture focusing technique was used for image reconstruction. The measured -6-dB spatial resolutions were 181 mu m in axial and 448 mu m in lateral, respectively, at the depth of similar to 2.4 cm. The 3-D photoacoustic image of a carbon fiber phantom was successfully produced.
    Relation Link: http://www.ieee.org/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83599
    Appears in Collections:[電機工程學系] 期刊論文
    [光電研究中心] 期刊論文

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