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    NTHUR > College of Electrical Engineering and Computer Science > Department of Electrical Engineering > EE Journal / Magazine Articles  >  A 1.1 G MAC/s sub-word-parallel digital signal processor for wireless communication applications

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    Title: A 1.1 G MAC/s sub-word-parallel digital signal processor for wireless communication applications
    Authors: Huang, Yuan-Hao
    Ma, Hsi-Pin
    Liou, Ming-Luen
    Chiueh, Tzi-Dar
    Teacher: 黃元豪
    Date: 2004
    Publisher: Institute of Electrical and Electronics Engineers Inc.
    Relation: Solid-State Circuits, IEEE Journal of
    Volume 39, Issue 1, Jan. 2004 Page(s):169 - 183
    Keywords: Digital signal processing
    Microprocessor chips
    Wireless telecommunication systems
    Orthogonal frequency division multiplexing
    Code division multiple access
    Abstract: This work proposes a communication digital signal processor (DSP) suitable for massive signal processing operations in orthogonal frequency division multiplexing (OFDM) and code-division multiple-access (CDMA) communication systems. The OFDM-based IEEE 802.11a wireless LAN transceiver and CDMA-based WCDMA uplink receiver are simulated to evaluate the computation requirements of future communication systems. The architecture of the communication digital signal processor is established according to the computational complexity of these simulations. The proposed architecture supports basic butterfly operations, single/double-precision and real- and complex-valued multiplication-and-accumulation (MAC), squared error computation, and add-compare-select (ACS) operation. This butterfly/complex MAC architecture can greatly enhance the execution efficiency of operations often found in communication applications. The processor chip is fabricated using a 0.35-μm n-well one-poly four-metal CMOS technology. The fabricated DSP chip reaches a speed of 1.1 G MAC/s when operating in the high-speed mode, and it achieves 4 M MAC/s/mW in the low-power mode.
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    Appears in Collections:[Department of Electrical Engineering] EE Journal / Magazine Articles
    [Institute of Communications Engineering] COM Journal / Magazine Articles
    [Design Technology Center ] DTC Journal / Magazine Articles

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