National Tsing Hua University Institutional Repository:Post-routing redundant via insertion for yield/reliability improvement
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    NTHUR > College of Electrical Engineering and Computer Science > Department of Computer Science > CS Conference Papers >  Post-routing redundant via insertion for yield/reliability improvement

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    Title: Post-routing redundant via insertion for yield/reliability improvement
    Authors: Lee,Kuang-Yao
    Teacher: 王廷基
    Date: 2006
    Publisher: Institute of Electrical and Electronics Engineers Inc
    Relation: Design Automation, 2006. Asia and South Pacific Conference on
    24-27 Jan. 2006 Page(s):6 pp.
    Keywords: Routers
    Failure analysis
    Graphic methods
    Heuristic methods
    Program processors
    Mathematical models
    Problem solving
    Abstract: Reducing the yield loss due to via failure is one of the important problems in design for manufacturability. A well known and highly recommended method to improve via yield/reliability is to add redundant vias. In this paper we study the problem of post-routing redundant via insertion and formulate it as a maximum independent set (MIS) problem. We present an efficient graph construction algorithm to model the problem, and an effective MIS heuristic to solve the problem. The experimental results show that our MIS heuristic inserts more redundant vias and distributes them more uniformly among via layers than a commercial tool and an existing method. The number of inserted redundant vias can be increased by up to 21.24%. Besides, since redundant vias can be classified into on-track and off-track ones, and on-track ones have better electrical properties, we also present two methods (one is modified from the MIS heuristic, and the other is applied as a post processor) to increase the amount of ontrack redundant vias. The experimental results indicate that both methods perform very well. © 2006 IEEE.
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    Appears in Collections:[Department of Computer Science] CS Conference Papers
    [Design Technology Center ] DTC Conference Papers

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