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    顯示項目1-25 / 2262. (共91頁)
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    2011 Cost modeling and analysis for interposer-based three-dimensional IC Y.-W. Chou; P.-Y. Chen; M. Lee; C.-W. Wu
    2011 A memory failure pattern analyzer for memory diagnosis and repair B.-Y. Lin; M. Lee; C.-W. Wu
    2011 Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer base C.-C. Chi; E. J. Marinissen; S. K. Goel; C.-W. Wu
    2011 Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base C.-C. Chi; E. J. Marinissen; S. K. Goel; C.-W. Wu
    2011 Built-in self-forming, built-in self-test, and built-in self-repair for RRAM yield improvement C.-Y. Chen; H.-C. Shih; M. Lee; C.-W. Wu; C.-H. Lin; S.-S. Sheu
    2011 A low-cost wireless interface with no external antenna and crystal oscillator for cm-range contactless testing C.-F. Li; C.-Y. Lee; C.-H. Wang; S.-L. Chang; Y.-S. Kuo; L.-M. Denq; C.-C. Chi; T.-Y. Chang; H.-J. Hsu; M.-Y. Chu; C.-T. Huang; J.-J. Liou; S.-Y. Huang; P.-C. Huang; H.-P. Ma; J.-C. Bor; C.-C. Tien; C.-H. Wang; C.-W. Wu
    2011 DfT architecture for 3D-SICs with multiple towers C.-C. Chi; E. J. Marinissen; S. K. Goel; C.-W. Wu
    2011 A built-in self-test scheme for the post-bond test of TSVs in 3D Ics Y.-J. Huang; J.-F. Li; J.-J. Chen; D.-M. Kwai; Y.-F. Chou; C.-W. Wu
    2011 Training-based forming process for RRAM yield improvement H.-C. Shih; C.-Y. Chen; C.-W. Wu; C.-H. Lin; S.-S. Sheu
    2011 A self-testing and calibration method for embedded successive approximation register ADC X.-L. Huang; P.-Y. Kang; H.-M. Chang; J.-L. Huang; Y.-F. Chou; Y.-P. Lee; D.-M. Kwai; C.-W. Wu
    2010 A test integration methodology for 3D integrated circuits C.-W. Chou; J.-F. Li; J.-J. Chen; D.-M. Kwai; Y.-F. Chou; C.-W. Wu
    2010 Is 3D integration the way out of the crossroads? D.-M. Kwai; Y.-F. Chou; C.-W. Wu
    2010 AF-Test: Adaptive-frequency scan test methodology for small-delay defects T.-Y. Lee; S.-Y. Huang; H.-J. Hsu; C.-W. Tzeng; C.-T. Huang; J.-J. Liu; H.-P. Ma; P.-C. Huang; J.-C. Bor; C.-W. Wu; C.-C. Tien; M. Wang
    2010 Is automotive electronics creating new opportunities for semiconductor? C.-W. Wu; J.-J. Tang
    2010 Is 3D integration an opportunity or just a hype? J.-F. Li; C.-W. Wu
    1991 Design of A Parallel Theorem Prover for First Order Logic Chen, W.-T.; Chou, T.-R.; Kuen-Rong Hsieh; Liu, H.-J.
    2010 Demonstration Abstract: A Multi-view Visual Surveillance System Based on Angle Coverage W. T. Chen; Yu-Chee Tseng
    2010 Implementation of the University-Industry Collaboration at National Tsing Hua University in Taiwan W. T. Chen; Yi-Min Guo; Po-Yu Chen; Youn-Long Lin; Chen-Fu Chien; Dah-Tsyr Chang; Hsiao-Wei Chiang; Wei-Chung Wang
    2002 Mobile IP and Ad Hoc Networks: An Integration and Implementation Experience Yu-Chee Tseng; Chia-Ching Shen; W. T. Chen
    2003 An Adaptive MAC Protocol for Wireless Ad Hoc Networks using Smart Antenna System W. T. Chen; Meng-Shiuan Pan
    2005 An Overview of the Project for Next Generation Information Communications Networks W. T. Chen; Wen-Hsiang Tsai; Chung-Ta King; Yaw-Chung Chen
    2005 An MAC Protocol for Ad-Hoc Wireless Networks using Smart Antennas W. T. Chen; Te-Wei Ho; Yen-Chin Chen
    2006 An Interest-based Architecture for Peer-to-Peer Network Systems W. T. Chen; Chi-Hong Chao; Jeng-Long Chiang
    2006 A Hierarchical Clustering Channel Assignment Scheme for Multi-channel Wireless Networks W. T. Chen; Chih-Jen Wu; Jen-Chu Liu
    2007 A Group Tour Guide System by RFIDs and Wireless Sensor Networks Po-Yu Chen; W. T. Chen; Cheng-Han Wu; Yu-Chee Tseng; Chi-Fu Huang

    顯示項目1-25 / 2262. (共91頁)
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