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    最後更新時間: 2020-01-24 22:46





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    顯示項目1-25 / 845. (共34頁)
    1 2 3 4 5 6 7 8 9 10 > >>

    2011 Cost modeling and analysis for interposer-based three-dimensional IC Y.-W. Chou; P.-Y. Chen; M. Lee; C.-W. Wu
    2011 A memory failure pattern analyzer for memory diagnosis and repair B.-Y. Lin; M. Lee; C.-W. Wu
    2011 Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer base C.-C. Chi; E. J. Marinissen; S. K. Goel; C.-W. Wu
    2011 Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base C.-C. Chi; E. J. Marinissen; S. K. Goel; C.-W. Wu
    2011 Built-in self-forming, built-in self-test, and built-in self-repair for RRAM yield improvement C.-Y. Chen; H.-C. Shih; M. Lee; C.-W. Wu; C.-H. Lin; S.-S. Sheu
    2011 A low-cost wireless interface with no external antenna and crystal oscillator for cm-range contactless testing C.-F. Li; C.-Y. Lee; C.-H. Wang; S.-L. Chang; Y.-S. Kuo; L.-M. Denq; C.-C. Chi; T.-Y. Chang; H.-J. Hsu; M.-Y. Chu; C.-T. Huang; J.-J. Liou; S.-Y. Huang; P.-C. Huang; H.-P. Ma; J.-C. Bor; C.-C. Tien; C.-H. Wang; C.-W. Wu
    2011 DfT architecture for 3D-SICs with multiple towers C.-C. Chi; E. J. Marinissen; S. K. Goel; C.-W. Wu
    2011 A built-in self-test scheme for the post-bond test of TSVs in 3D Ics Y.-J. Huang; J.-F. Li; J.-J. Chen; D.-M. Kwai; Y.-F. Chou; C.-W. Wu
    2011 Training-based forming process for RRAM yield improvement H.-C. Shih; C.-Y. Chen; C.-W. Wu; C.-H. Lin; S.-S. Sheu
    2011 A self-testing and calibration method for embedded successive approximation register ADC X.-L. Huang; P.-Y. Kang; H.-M. Chang; J.-L. Huang; Y.-F. Chou; Y.-P. Lee; D.-M. Kwai; C.-W. Wu
    2010 A test integration methodology for 3D integrated circuits C.-W. Chou; J.-F. Li; J.-J. Chen; D.-M. Kwai; Y.-F. Chou; C.-W. Wu
    2010 Is 3D integration the way out of the crossroads? D.-M. Kwai; Y.-F. Chou; C.-W. Wu
    2010 AF-Test: Adaptive-frequency scan test methodology for small-delay defects T.-Y. Lee; S.-Y. Huang; H.-J. Hsu; C.-W. Tzeng; C.-T. Huang; J.-J. Liu; H.-P. Ma; P.-C. Huang; J.-C. Bor; C.-W. Wu; C.-C. Tien; M. Wang
    2010 Is automotive electronics creating new opportunities for semiconductor? C.-W. Wu; J.-J. Tang
    2010 Is 3D integration an opportunity or just a hype? J.-F. Li; C.-W. Wu
    2011 Cooperative beamforming with multi-relay selection for wireless ad hoc networks Chin-Liang Wang; Ting-Nan Cho; Syue-Ju Syue
    2011 An improved constellation extension scheme for PAPR reduction in OFDM systems Chin-Liang Wang; Shun-Sheng Wang; Yi-Ching Huang
    2011 An improved adaptive receiver for OFDM systems using conjugate transmission Chin-Liang Wang; Po-Chung Shen; Jia-Hong Huang
    2011 A credibility-based cooperative spectrum sensing technique for cognitive radio systems Chin-Liang Wang; Han-Wei Chen; Yu-Ren Chou
    2011 Low-complexity joint timing synchronization and channel estimation for MIMO OFDM systems Chin-Liang Wang; Hung-Chin Wang
    2011 Low-complexity ML Doppler spread estimation for OFDM systems Yuh-Ren Tsai; Kai-Jie Yang; Chia-Hong Tsai; Chin-Liang Wang
    2011 A compact preamble design for synchronization in distributed MIMO OFDM systems Hung-Chin Wang; Chin-Liang Wang
    2012 A synchronization scheme based on partial Zadoff-Chu sequences for cooperative MIMO OFDM systems Chin-Liang Wang; Hung-Chin Wang; Ying-Yi Chen
    2012 Throughput maximization for cognitive radio networks with wideband spectrum sensing Chin-Liang Wang; Han-Wei Chen; Zong-Ying Tsai
    2012 Coverage- extended cooperative geographic routing with optimal power allocation for wireless multihop networks Syue-Ju Syue; Chin-Liang Wang; Vincent Gauthier; Pei-Shan Tsai

    顯示項目1-25 / 845. (共34頁)
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