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    National Tsing Hua University Institutional Repository > 工學院  > 化學工程學系 > 會議論文 >  3D numerical simulation of Flip-Chip underfill encapsulation

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/37750

    Title: 3D numerical simulation of Flip-Chip underfill encapsulation
    Authors: Wang, Yung-Yuan;Hsu, Chi Chung;Chang, Rong-Yeu
    教師: 張榮語
    Date: 2005
    Publisher: Society of Plastics Engineers
    Relation: Annual Technical Conference - ANTEC, Conference Proceedings, Volume 4, 2005, Pages 334-338
    Keywords: Contact angle
    Approximation theory
    Finite volume method
    Mathematical models
    Computer simulation
    Abstract: ©2005 SPE - The analysis of encapsulant flow during under-fill encapsulation would be discussed in this work. With solving the melt-front positions based on 3D Finite Volume Method, we get better predictions than 2.5D simulation. For the surface effects a
    URI: http://www.4spe.org/
    Appears in Collections:[化學工程學系] 會議論文

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