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    National Tsing Hua University Institutional Repository > 工學院  > 化學工程學系 > 期刊論文 >  Study of the mechanism of additives on copper dissolution in monoethanolamine-complexed cupric ion solution

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/37807

    Title: Study of the mechanism of additives on copper dissolution in monoethanolamine-complexed cupric ion solution
    Authors: C-W. Shih;Y-Y. Wang;C-C. Wan
    教師: 王詠雲
    Date: 2002
    Publisher: Springer Verlag
    Relation: JOURNAL OF APPLIED ELECTROCHEMISTRY, Springer Verlag, Volume 32, Issue 9, SEP 2002, Pages 987-992
    Keywords: bridging ligands
    copper dissolution
    Abstract: c2002 Springer - The dissolution of copper in monoethanolamine (MEA)-complexed cupric ion solution containing different additives was studied. Bridging ligands, such as F–, Cl–, Br–, I–, SCN–, and oxidizers, including S2O8 2–, Cr2O7 2–, MnO4 – were added to this nonammoniacal etching solution to increase the copper dissolution rate. Potentiodynamic methods were employed to elucidate the dissolution mechanism and the corrosion potential (E corr) was found to shift from 10 to 90 mV as opposed to that of the original solution (0.045 M cupric sulfate and 0.225 M MEA) for bridging ligands. In contrast, some conventional oxidizers were also added in the etchant and the E corr did not shift obviously. Therefore, we proposed that copper dissolution proceeds through an 「inner-sphere」 pathway in solution containing bridging ligands. The electron is transferred from the copper surface into the cupric species through the ligands, which greatly influences the copper dissolution rate. The order of effectiveness of these ligands is SCN– > I– > Br– > Cl– > F–, which is related to their polarizability.
    URI: http://www.springerlink.com/
    Appears in Collections:[化學工程學系] 期刊論文

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