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    National Tsing Hua University Institutional Repository > 工學院  > 化學工程學系 > 期刊論文 >  Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-Rich corner

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/39478

    Title: Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-Rich corner
    Authors: Chen, Sinn-Wen;Chang, Cheng-A N.
    教師: 陳信文
    Date: 2004
    Publisher: Springer Verlag
    Relation: JOURNAL OF ELECTRONIC MATERIALS, Springer Verlag, Volume 33, Issue 10, 2004, Pages 1071-1079
    Keywords: Tin alloys
    Phase equilibria
    Reaction kinetics
    Soldering alloys
    Printed circuit boards
    X ray diffraction
    Scanning electron microscopy
    Abstract: c2004 Springer - Knowledge of phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner is important for the understanding of the interfacial reactions at the Sn-Ag-Cu/Ni contacts, which are frequently encountered in recent microelectronic products. Various Sn-Ag-Cu-Ni alloys were prepared and equilibrated at 250°C. The alloys were then quenched and analyzed. The phases were determined by metallography, compositional analysis, and x-ray diffraction (XRD) analysis. No quaternary phases were found. The isoplethal sections at 60at.%Sn, 70at.%Sn, 80at.%Sn, and 90at.%Sn at 250°C are determined. The phase equilibrium relationship was proposed based on the quaternary experimental results and the 250°C isothermal sections of the four constituent ternary systems, Sn-Ag-Cu, Sn-Ag-Ni, Sn-Cu-Ni, and Cu-Ag-Ni. Because there are no ternary phases in all these three systems, all the compounds are in fact binary compounds with various solubilities of the other two elements.
    URI: http://www.springerlink.com/
    Appears in Collections:[化學工程學系] 期刊論文

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