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    National Tsing Hua University Institutional Repository > 工學院  > 化學工程學系 > 期刊論文 >  Interfacial reactions in Sn-0.7wt.%Cu/Ni-V couples at 250 degrees C


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/39501


    Title: Interfacial reactions in Sn-0.7wt.%Cu/Ni-V couples at 250 degrees C
    Authors: Chen SW (Chen, Sinn-Wen);Chen CC (Chen, Chih-Chi)
    教師: 陳信文
    Date: 2007
    Publisher: Springer Verlag
    Relation: JOURNAL OF ELECTRONIC MATERIALS, Springer Verlag, Volume 36, Issue 9, SEP 2007, Pages 1121-1128
    Keywords: LEAD-FREE SOLDERS
    INTERMETALLIC COMPOUNDS
    PHASE-EQUILIBRIA
    NI
    METALLIZATION
    JOINTS
    ALLOYS
    REFLOW
    CU/NI
    Abstract: c2007 Springer - The Delco process is a major flip chip under-bump metallurgy process and its contact is soldered with the Ni-7wt.%V substrate; there are, however, only a few studies on the interfacial reactions between solders and Ni-V alloys. This study examines the interfacial reactions of the Sn-0.7wt.%Cu alloy with the Ni-7wt.%V, Ni-5wt.%V, and Ni-3wt.%V substrates at 250 degrees C. It is found that the interfacial reactions between Sn-0.7wt.%Cu and Ni-V alloys are different from those between Sn-0.7wt.%Cu and pure Ni. In addition to the formation of the Cu6Sn5 phase, a new Sn-rich phase, denoted the Q phase, is found in the Ni-V substrate couples. Nucleation of the Ni3Sn4 phase is at a much earlier stage and the rates of consumption of Ni are much higher in Ni-V substrate couples than in Ni substrate couples. Knowledge of these different reactions is important for proper assessment of the flip chip products.
    URI: http://www.springerlink.com/
    http://nthur.lib.nthu.edu.tw/handle/987654321/39501
    Appears in Collections:[化學工程學系] 期刊論文

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