National Tsing Hua University Institutional Repository:Tapered Cu pattern metallization by electrodeposition through mask
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    National Tsing Hua University Institutional Repository > 工學院  > 化學工程學系 > 期刊論文 >  Tapered Cu pattern metallization by electrodeposition through mask


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    題名: Tapered Cu pattern metallization by electrodeposition through mask
    作者: Jenq,Shrane Ning;Wan,Chi Chao;Wang,Yung Yun;Li,Hung Wei;Liu,Po Tsun;Chen,Jing Hon
    教師: 萬其超
    日期: 2006
    出版者: Electrochemical Society
    關聯: ELECTROCHEMICAL AND SOLID STATE LETTERS, Electrochemical Society, Volume 9, Issue 10, 2006, Pages C167-C170
    關鍵詞: Electrodeposition
    Metallizing
    Copper
    Thin film transistors
    Polyethylene glycols
    Additives
    Electrochemistry
    摘要: ©2006 Electrochem - A tapered shape of Cu pattern by electrodeposition through mask is preferred for fabricating metal line on thin-film transistors (TFTs). The influence of individual organic additive [polyethylene glycol (PEG), bis-3-sodiumsulfopropyl disulfide (SPS)] on the sidewall shape of the Cu pattern was identified. A compromising effect shows up when both PEG and SPS are added owing to the competition of the behavior of two different organic additives during Cu electrodeposition. Therefore, a method has been developed for the fabrication of copper pattern used in TFTs, which forms a tapered pattern in one single Cu deposition step.
    URI: http://www.electrochem.org/
    http://nthur.lib.nthu.edu.tw/handle/987654321/39895
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