National Tsing Hua University Institutional Repository:Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
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    National Tsing Hua University Institutional Repository > 工學院  > 工業工程與工程管理學系 > 會議論文  >  Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity


    题名: Overall Wafer Effectiveness (OWE): A Novel Industry Standard for Wafer Productivity
    作者: Chen-Fu Chien;Chia-Yu Hsu;Hong-Shing Chou;Chih-Wei Lin
    教師: 簡禎富
    日期: 2006
    出版者: Institute of Electrical and Electronics Engineers
    關聯: IEEE International Symposium on Semiconductor Manufacturing, 2006. ISSM 2006, 25-27 Sept. 2006, pages 317-320
    关键词: productivity
    semiconductor device manufacture
    摘要: Overall equipment efficiency (OEE) is an index that is widely used to measure equipment performance for semiconductor manufacturing. However, little research has been done to address productivity from the perspective of wafer exposure performance. This study aims to propose a novel standard, overall wafer effectiveness (OWE), to evaluate the effectiveness of wafer exposure rather than only considering tool productivity. Furthermore, the proposed OWE can be easily extended to incorporate additional attributes such as throughput, yield, and price. In particular, a weighted OWE that integrates mask field utilization and OWE is illustrated with numerical example to show the practical viability of OWE as a semiconductor industry standard to drive collaborative efforts among IC designers, equipment vendors, and manufacturers for enhancing total wafer effectiveness.
    显示于类别:[工業工程與工程管理學系] 會議論文


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