Inspection plays an important role in the semiconductor industry. In this paper, we focus on the inspection task after wire bonding in packaging. The purpose of wire bonding (W/B) is to connect the bond pads with the lead fingers. Two major types of defects are (1) bonding line missing and (2) bonding line breakage. The numbers of bonding lines and bonding balls are used as the features for defect classification. The proposed method consists of image preprocessing, orientation determination, connection detection, bonding line detection, bonding ball detection, and defect classification. The proposed method is simple and fast. The experimental results show that the proposed method can detect the defects effectively.