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    National Tsing Hua University Institutional Repository > 工學院  > 工業工程與工程管理學系 > 期刊論文 >  Automated post bonding inspection by using machine vision techniques

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/46674

    Title: Automated post bonding inspection by using machine vision techniques
    教師: 王茂駿
    Date: 2002
    Publisher: Taylor & Francis
    Relation: International Journal of Production Research, Volume 40, Issue 12, August 2002, pages 2835 - 2848
    Keywords: computer vision
    flaw detection
    integrated circuit manufacture
    integrated circuit packaging
    lead bonding
    Abstract: Inspection plays an important role in the semiconductor industry. In this paper, we focus on the inspection task after wire bonding in packaging. The purpose of wire bonding (W/B) is to connect the bond pads with the lead fingers. Two major types of defects are (1) bonding line missing and (2) bonding line breakage. The numbers of bonding lines and bonding balls are used as the features for defect classification. The proposed method consists of image preprocessing, orientation
    determination, connection detection, bonding line detection, bonding ball detection, and defect classification. The proposed method is simple and fast. The experimental results show that the proposed method can detect the defects effectively.
    URI: http://www.tandf.co.uk/journals/default.asp
    Appears in Collections:[工業工程與工程管理學系] 期刊論文

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