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    National Tsing Hua University Institutional Repository > 原子科學院  > 工程與系統科學系 > 會議論文  >  A precision alignment method to <100> direction on (110) silicon wafer


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47208


    Title: A precision alignment method to <100> direction on (110) silicon wafer
    Authors: Fan-Gang Tseng;Kai-Chen Chang
    教師: 曾繁根
    Date: 2003
    Publisher: American Society of Mechanical Engineers
    Relation: J. Micromech. Microeng. , American Society of Mechanical Engineers, v 13, Pages 47-52
    Keywords: pre-etch
    bulk-etched
    orientation-alignment
    Abstract: This paper proposes a novel pre-etch method to determine the <100> direction on (110) silicon wafers for bulk etching. Series of circular windows were arranged in an arc of radius 48.9 mm, and bulk-etched to form hexagonal shapes for crystal orientation finding. The corners of the hexagons can be used as an alignment reference for the indication of the <100> direction on (110) silicon wafers. This innovative approach has been demonstrated experimentally to give an orientation-alignment accuracy of ±0.03° for (110) wafers with 4-inch diameter
    URI: http://www.iop.org/EJ/article/0960-1317/13/1/307/jm3107.pdf?request-id=97b1efea-75aa-45b2-a12b-824f61ecd208
    http://www.asme.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47208
    Appears in Collections:[工程與系統科學系] 會議論文

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