English  |  正體中文  |  简体中文  |  Items with full text/Total items : 54367/62174 (87%)
Visitors : 13839734      Online Users : 249
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    National Tsing Hua University Institutional Repository > 原子科學院  > 工程與系統科學系 > 會議論文  >  EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3-D microstructures


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47211


    Title: EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3-D microstructures
    Authors: Cohen, Adam;Frodis, Uri;Tseng, Fan-Gang;Zhang, Gang;Mansfeld, Florian;Will, Peter
    教師: 曾繁根
    Date: 1999
    Publisher: International Society for Optical Engineering
    Relation: Proc. SPIE, International Society for Optical Engineering, Vol. 3874, 1999, Pages 236
    Keywords: EFAB
    Electrochemical FABrication
    MEMS
    Abstract: EFAB ('Electrochemical FABrication') is a new micromachining process promising to rapidly and automatically batch fabricate high-aspect-ratio microstructures with arbitrary 3-D geometry using inexpensive equipment. Conventional microfabrication processes have so far produced fairly simple geometries (e.g., 1-5 structural layers), yet many MEMS could benefit if more sophisticated shapes could be manufactured. By using 'Instant Masking' (IM)-a novel in-situ micropatterning method-to simplify, accelerate, and automate through-mask electroplating, EFAB can produce extremely complex shapes by depositing hundreds-thousands of layers at high speed. While other processes often do not allow integration with ICs, EFAB operates at less than 60°C, making IC compatibility a possibility. Alternative processes require costly facilities and equipment; EFAB separates photolithography from device fabrication, requiring a cleanroom only for mask-making, then depositing all layers in a low-cost, self-contained machine. All Instant Masks required can be prepared simultaneously, without repeating the lithography on each layer. Selective electrodeposition requires simply mating the mask with the substrate and applying current; in this way we have patterned well-defined features as small as 20 × 20 µm. The procedures in EFAB are selective electrodeposition, blanket electrodeposition, and planarization. To date we have built metal structures with up to 12 layers consisting of independently-moving components.
    URI: http://spie.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47211
    Appears in Collections:[工程與系統科學系] 會議論文

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML684View/Open


    在NTHUR中所有的資料項目都受到原著作權保護,僅提供學術研究及教育使用,敬請尊重著作權人之權益。若須利用於商業或營利,請先取得著作權人授權。
    若發現本網站收錄之內容有侵害著作權人權益之情事,請權利人通知本網站管理者(smluo@lib.nthu.edu.tw),管理者將立即採取移除該內容等補救措施。

    SFX Query

    與系統管理員聯絡

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback