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    National Tsing Hua University Institutional Repository > 原子科學院  > 工程與系統科學系 > 期刊論文 >  Characterization and modeling of out-diffusion of manganese and zinc impurities from deep ultraviolet photoresist


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47268


    Title: Characterization and modeling of out-diffusion of manganese and zinc impurities from deep ultraviolet photoresist
    Authors: Mei-Ya Wang;Fu-Hsiang Ko;Tien-Ko Wang;Chin-Cheng Yang;Tiao-Yuan Huang
    教師: 王天戈
    Date: 1999
    Publisher: Electrochemical Society
    Relation: JOURNAL OF THE ELECTROCHEMICAL SOCIETY, Electrochemical Society, Volume 146, Issue 9, SEP 1999, Pages 3455-3460
    Keywords: PLASMA-MASS-SPECTROMETRY
    SILICON-WAFERS
    PROCESS CHEMICALS
    CONTAMINATION
    INTERFERENCES
    METALS
    IMPACT
    CU
    Abstract: The radioactive tracer technique was applied to investigate the out-diffusion of manganese and zinc impurities from deep-ultraviolet (DUV) photoresist. Two important process parameters, viz., baking temperature and the type of substrate (i.e., bare silicon, polysilicon, oxide, or nitride), were evaluated. Our results indicated that diffusion ratios were all below 6%, irrespective of the substrate type and baking temperature. The substrate type did not appear to strongly affect the metallic impurity out-diffusion from DUV photoresist. However, solvent evaporation was found to have a significant effect on impurity diffusion. A new model, together with a new parameter, was proposed to describe the out-diffusion behavior of impurities from DUV photoresist. This model could explain the diffusion ratio of metallic impurities in photoresist layers under various baking conditions. The effectiveness of various wet cleaning recipes in removing metallic impurities such as manganese and zinc was also studied. It was found that (i) bath life due to temperature change can considerably affect the cleaning efficiency, and (ii) hot water immersion can effectively dissolve the impurities from the wafer surface
    URI: http://www.electrochem.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47268
    Appears in Collections:[工程與系統科學系] 期刊論文

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