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    National Tsing Hua University Institutional Repository > 原子科學院  > 工程與系統科學系 > 期刊論文 >  HRTEM investigation of the multiplicity of Σ = 9 [0 1 over-bar 1]/(1 2 2) symmetric tilt grain boundary in Cu

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47688

    Title: HRTEM investigation of the multiplicity of Σ= 9 [0 1 over-bar 1]/(1 2 2) symmetric tilt grain boundary in Cu
    Authors: Hu,J. R.;Chang,S. C.;Chen,F. R.;Kai,J. J.
    教師: 陳福榮
    Date: 2002
    Publisher: Elsevier
    Relation: Materials Chemistry and Physics, Elsevier, Volume 74, Issue 3, 1 April 2002, Pages 313-319
    Keywords: Computational methods
    Transmission electron microscopy
    Dislocations (crystals)
    High resolution electron microscopy
    Relaxation processes
    Grain boundaries
    Compressive stress
    Tensile stress
    Abstract: Σ = 9[0 1 over-bar 1]/(1 2 2) symmetric tilt grain boundary in Cu is investigated using high resolution transmission electron microscopy (HRTEM). Modified mirror and glide-mirror symmetric structural units (SUs) are found to coexist in the grain boundary. Partial dislocations with Burgers vectors close to half a displacement shift complete (DSC) lattice are introduced to connect the glide-mirror symmetric structural unit (SU) with the modified mirror symmetric one in the grain boundary. The Burgers vectors are analyzed to be close to a/18 [1 2 2]L // a/18 [1 2 2]R and a/36 [4 over-bar 1 1]L // a/36 [4 over-bar 1 1]R. The volume expansion per unit area of the grain boundary, δV/A, in the glide-mirror symmetric region is determined as -0.00238 nm which is a little smaller than that in rigid-body model, while theδV/A in the modified mirror symmetric region is computed as 0.03221 nm which is larger than that in the same model. The two values of δV/A are corresponding to compressive and tensile stress field, respectively. One possible mirror and glide-mirror symmetric structural model is proposed according to atomic relaxations. © 2002 Elsevier Science B.V. All rights reserved.
    URI: http://www.elsevier.com/
    Appears in Collections:[工程與系統科學系] 期刊論文

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