English  |  正體中文  |  简体中文  |  Items with full text/Total items : 54367/62174 (87%)
Visitors : 14750280      Online Users : 94
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    National Tsing Hua University Institutional Repository > 原子科學院  > 工程與系統科學系 > 期刊論文 >  Localized bonding processes for assembly and packaging of polymeric MEMS

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/48304

    Title: Localized bonding processes for assembly and packaging of polymeric MEMS
    Authors: Su,Yu-Chuan;Lin,Liwei
    教師: 蘇育全
    Date: 2005
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE TRANSACTIONS ON ADVANCED PACKAGING, Institute of Electrical and Electronics Engineers, Volume 28, Issue 4, 2005, Pages 635-642
    Keywords: Encapsulation
    Sealing (finishing)
    Low temperature effects
    Pressure effects
    Electronics packaging
    Glass bonding
    Microelectromechanical devices
    Semiconducting polymers
    Abstract: Localized bonding schemes for the assembly and packaging of polymer-based microelectromechanical systems (MEMS) devices have been successfully demonstrated. These include three bonding systems of plastics-to-silicon, plastics-to-glass, and plastics-to-plastics combinations based on two bonding processes of localized resistive heating: 1) built-in resistive heaters and 2) reusable resistive heaters. In the prototype demonstrations, aluminum thin films are deposited and patterned as resistive heaters and plastic materials are locally melted and solidified for bonding. A typical contact pressure of 0.4 MPa is applied to assure intimate contact of the two bonding substrates and the localized bonding process is completed within less than 0.25 s of heating. It is estimated that the local temperature at the bonding interface can reach above 150 °C while the substrate temperature away from the heaters can be controlled to be under 40 °C during the bonding process. The approach of localized heating for bonding of plastic materials while maintaining low temperature globally enables direct sealing of polymer-based MEMS without dispensing additional adhesives or damaging preexisting, temperature-sensitive substances. Furthermore, water encapsulation by plastics-to-plastics bonding is successfully performed to demonstrate the capability of low temperature processing. As such, this technique can be applied broadly in plastic assembly, packaging, and liquid encapsulation for microsystems, including microfluidic devices. © 2005 IEEE.
    URI: http://www.ieee.org/
    Appears in Collections:[工程與系統科學系] 期刊論文

    Files in This Item:

    There are no files associated with this item.


    SFX Query


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback