National Tsing Hua University Institutional Repository:Vibration reliability in flip chip package
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    Title: Vibration reliability in flip chip package
    Authors: Yeh, Meng-Kao;Zhong, Wei-Xun
    Teacher: 葉孟考
    Date: 2005
    Publisher: Trans Tech Publications
    Relation: ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, Trans Tech Publications, Volume 297-300, 2005, Pages 899-904
    Keywords: Electronics packaging
    Elastic moduli
    Fatigue of materials
    Flip chip devices
    Numerical methods
    Reliability analysis
    Vibration analysis
    Abstract: The reliability of the flip chip package under vibration was investigated. The stress values of the package under forced vibration were calculated using ANSYS code. The vibration induced fatigue life of the flip chip package was found based on the stress-cycle curve of the solder bump. The vibration experiment was performed for the flip chip package to validate the numerical results. The relations between the external force and the acceleration of the package without added mass were established first; then they were applied in the analysis to evaluate the fatigue life of the flip chip package under harmonic vibration. The results show that a longer fatigue life or a better reliability of the flip chip package was obtained for thicker die in the package, for larger fillet angles and larger Young's modulus of the underfill, and for the package under higher external excitation frequencies.
    Appears in Collections:[Department of Power Mechanical Engineering] PME Journal / Magazine Articles

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