National Tsing Hua University Institutional Repository:Vibration reliability in flip chip package
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 54367/62174 (87%)
造访人次 : 14636374      在线人数 : 72
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/50449


    题名: Vibration reliability in flip chip package
    作者: Yeh, Meng-Kao;Zhong, Wei-Xun
    教師: 葉孟考
    日期: 2005
    出版者: Trans Tech Publications
    關聯: ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, Trans Tech Publications, Volume 297-300, 2005, Pages 899-904
    关键词: Electronics packaging
    Elastic moduli
    Fatigue of materials
    Flip chip devices
    Numerical methods
    Reliability analysis
    Vibration analysis
    摘要: The reliability of the flip chip package under vibration was investigated. The stress values of the package under forced vibration were calculated using ANSYS code. The vibration induced fatigue life of the flip chip package was found based on the stress-cycle curve of the solder bump. The vibration experiment was performed for the flip chip package to validate the numerical results. The relations between the external force and the acceleration of the package without added mass were established first; then they were applied in the analysis to evaluate the fatigue life of the flip chip package under harmonic vibration. The results show that a longer fatigue life or a better reliability of the flip chip package was obtained for thicker die in the package, for larger fillet angles and larger Young's modulus of the underfill, and for the package under higher external excitation frequencies.
    URI: http://md1.csa.com/partners/viewrecord.php?requester=gs&collection=TRD&recid=2005135536094MD&recid=2005136158599MT&recid=2005132220333EA
    http://www.ttp.net/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/50449
    显示于类别:[動力機械工程學系] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    index.html0KbHTML392检视/开启


    在NTHUR中所有的資料項目都受到原著作權保護,僅提供學術研究及教育使用,敬請尊重著作權人之權益。若須利用於商業或營利,請先取得著作權人授權。
    若發現本網站收錄之內容有侵害著作權人權益之情事,請權利人通知本網站管理者(smluo@lib.nthu.edu.tw),管理者將立即採取移除該內容等補救措施。

    SFX Query

    與系統管理員聯絡

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回馈