National Tsing Hua University Institutional Repository:Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
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    National Tsing Hua University Institutional Repository > 工學院  > 動力機械工程學系 > 期刊論文 >  Electromigration in pb-free SnAg3.8Cu0.7 solder stripes


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    题名: Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
    作者: Ying-Chao Hsu;Chung-Kwuang Chou;Liu, P.C.;Chih Chen;Yao, D.J.;Chou, T.;Tu, K.N.
    教師: 饒達仁
    日期: 2005
    出版者: American Institute of Physics
    關聯: JOURNAL OF APPLIED PHYSICS, American Institute of Physics, Volume 98, Issue 3, AUG 1 2005
    关键词: UNDER-BUMP-METALLIZATION
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    摘要: Electromigration behavior in the eutectic SnAg3.8Cu0.7 solder stripes was investigated in the vicinity of the device operation temperature of 100 degrees C by using the edge displacement technique. Measurements were made for relevant parameters for electromigration of the solder, such as drift velocity, threshold current density, activation energy, as well as the product of diffusivity and effective charge number (DZ(*)). The threshold current densities were estimated to be 4.3x10(4) A/cm(2) at 80 degrees C, 3.2x10(4) A/cm(2) at 100 degrees C, and 1.4x10(4) A/cm(2) at 120 degrees C. These values represent the maximum current densities that the SnAg3.8Cu0.7 solder can carry without electromigration damage at the three stressing temperatures. The electromigration activation energy was determined to be 0.45 eV in the temperature range of 80-120 degrees C. The measured products of diffusivity and the effective charge number, DZ(*), were -1.8x10(-10) cm(2)/s at 80 degrees C, -5.0x10(-10) cm(2)/s at 100 degrees C, and -7.2x10(-10) cm(2)/s at 120 degrees C.
    URI: http://www.aip.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/50779
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