National Tsing Hua University Institutional Repository:Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating
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    NTHUR > College of Engineering  > Department of Power Mechanical Engineering > PME Conference Papers >  Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/50930


    Title: Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating
    Authors: Jiang, H.;Wang, Y.;Yeh, J.-L.A.;Tien, N.C.
    Teacher: 葉哲良
    Date: 2000
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE MTT-S International Microwave Symposium (IMS2000), BOSTON MA, JUN 11-16, 2000, Pages 279-282
    Keywords: Cu
    RF
    Abstract: Polysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities in the silicon substrate beneath. The metallization process simultaneously coated the inner surfaces of the cavities with Cu to form both good radio-frequency (RF) ground and electromagnetic shield. Quality factor (Q) up to 30 and self-resonance frequency (fres) higher than 10 GHz were achieved for a 10.4 nH inductor. Simulation showed that the Cu-lined cavities reduced the mutual inductance between two adjacent inductors by a factor of 5, compared with that without the cavities. This proves that good shielding was provided by the cavities
    URI: http://www.ieee.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/50930
    Appears in Collections:[Department of Power Mechanical Engineering] PME Conference Papers

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