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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Interfacial reaction kinetics between silver and ceramic-filled glass substrate

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/52188

    Title: Interfacial reaction kinetics between silver and ceramic-filled glass substrate
    Authors: Jean JH;Chang CR
    教師: 簡朝和
    Date: 2004
    Publisher: Wiley-Blackwell
    Relation: JOURNAL OF THE AMERICAN CERAMIC SOCIETY,Volume: 87,Issue: 7,Pages: 1287-1293,Published: JUL 2004
    Keywords: TEMPERATURE
    Abstract: Interfacial reaction kinetics between Ag and ceramic-filled glass (CFG) substrate, containing borosilicate glass, high-silica glass, and alumina, has been investigated at 850degrees-925degreesC in different atmospheres. No chemical reaction at the interface of Ag/CFG is found when firing takes place in N-2 or N-2 + 1% H-2, Fired in air, however, an interfacial reaction zone is formed at the interface of Ag/CFG with Ag+ ion diffusing from silver and Al3+ ion dissolving from CFG, and both ions are always coupled together in the reaction zone. Microstructural and chemical analyses show that the reaction zone consists of two distinct layers; one is homogeneous, and the other, heterogeneous. The homogeneous layer, which is adjacent to Ag, is uniform in microstructure with a composition rich in Ag+ and Al3+. The heterogeneous layer is not uniform in microstructure with Si-rich and Ag-Al-rich phases. The reaction zone moves toward CFG with time, forming a heterogeneous layer first and then converting into a homogenous layer when diffusion of Ag+ ion into the CFG becomes significant. The growth kinetics for the homogeneous layer follows a linear rate equation, whereas the heterogeneous layer, a parabolic rate equation. Activation analyses suggest that the formation of the homogeneous layer is controlled by the combination of breakage and formation of M-O bonds, but the heterogeneous layer, by the diffusion of Ag+ ion in the BSG.
    URI: http://as.wiley.com/WileyCDA/Brand/id-35.html
    Appears in Collections:[材料科學工程學系] 期刊論文

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