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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Solid-state reaction in an Au wire connection with an Al-Cu pad during aging


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/52604


    Title: Solid-state reaction in an Au wire connection with an Al-Cu pad during aging
    Authors: Jang,Guh-Yaw;Duh,Jenq-Gong;Takahashi,Hideyuki;Su,David
    教師: 杜正恭
    Date: 2006
    Publisher: Springer Verlag
    Relation: Journal of Electronic Materials
    Volume 35, Number 2, 323-332
    Keywords: Solid state physics
    Gold
    Copper
    Aging of materials
    Electronics packaging
    Integrated circuits
    Intermetallics
    Etching
    Coating techniques
    Phase transitions
    Abstract: In integrated-circuit packages, wire-bonding techniques are the preferred methods for making electrical connections between the chip and the lead frame. The influence of aging at 150°C up to 3,000 hr on interfacial reactions of Au wire bonded with the Al-Cu pad was investigated herein. To observe various intermetallic compounds (IMCs) with field-emission scanning electron microscopy, polished samples were ion-milled through precision etching and coating techniques. Three IMCs, i.e., (Al,Cu)Au4, (Al,Cu)3Au 8, and (Al,Cu)Au2, were found between the Au wire and the Al-Cu pad in the as-assembled wire bond. After 168 hr of aging, Al 3(Au,Cu)8 formed between (Al,Cu)3Au8 and (Al,Cu)Au2 in the center of the wire bond. In fact, the Al-Cu pad, (Al,Cu)Au2, and Al3(Au,Cu)8 IMCs were completely reacted after 500 hr of aging. (Al,Cu)3Au8 was thus transformed into (Al,Cu)Au4. Near the edge of the wire bonds, (Al,Cu)Au2 formed between the Al-Cu pad and (Al,Cu) 3Au8 during 500 hr of aging. For aging longer than 1000 hr, Al3(Au,Cu)8 was detected between (Al,Cu) 3Au8 and (Al,Cu)Au2. It was noted that the Al3(Au,Cu)8 IMC gradually grew with aging. With the aid of microstructure evolution and quantitative analysis, the interfacial phase transformation between the Au wire and the Al-Cu pad could be probed. In addition, the growth kinetics of (Al,Cu)Au4 and (Al,Cu) 3Au8 in the center of wire bonds were also evaluated and discussed.
    URI: http://www.springerlink.com/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/52604
    Appears in Collections:[材料科學工程學系] 期刊論文

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