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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Temperature cycling effects between Sn/Pb solder and thick filmPd/Ag conductor metallization

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/52868

    Title: Temperature cycling effects between Sn/Pb solder and thick filmPd/Ag conductor metallization
    Authors: Bi-Shiou Chiou;Liu, K.C.;Jeng-Gang Duh;Palanisamy, P.S.
    教師: 杜正恭
    Date: 1991
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE Transactions on, Volume 14 ,Issue 1, pp.233 - 237
    Keywords: environmental testing
    hybrid integrated circuits
    lead alloys
    life testing
    palladium alloys
    silver alloys
    thick film circuits
    tin alloys
    Abstract: Thermal cycling effects on solder joints between thick-film mixed bonded conductor and Sn/Pb solder are investigated. Microstructural evolution of the interfacial morphology, elemental, and phase distribution are probed with the aid of electron microscopy and X-ray diffraction. Microstructural analysis reveals the formation of intermetallic compounds Pd3Sn, Pd2Sn, Pd3 Sn2, PdSn, Pd3Pb, Ag5Sn, and Ag 3Sn, after thermal cycles from -55 to +125°C. A transverse crack is observed across the joint from the conductor/substrate interface to the conductor/solder interface, which results in the failure of the joint. The microstructural analysis and stress analysis reveal that the transverse crack is initiated by the microcracks at the glass-penetrated region of the substrate and propagates under a tensile stress due to the solder shrinkage. An appropriate joint geometry and a materials system with good interface strength and with negligible thermal expansion mismatch are important in the enhancement of the life time for the solder joints in thick-film microelectronics
    URI: http://www.ieee.org/
    Appears in Collections:[材料科學工程學系] 期刊論文

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