English  |  正體中文  |  简体中文  |  Items with full text/Total items : 54367/62174 (87%)
Visitors : 14639573      Online Users : 50
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Microstructural evolution in Sn/Pb solder and Pb/Ag thick filmconductor metallization

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/52896

    Title: Microstructural evolution in Sn/Pb solder and Pb/Ag thick filmconductor metallization
    Authors: Liu, K.-C.;Duh, J.-G.
    教師: 杜正恭
    Date: 1991
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE Transactions on, Volume 14, Issue 4, pp.703 - 707
    Keywords: tin alloys
    thick films
    silver alloys
    palladium alloys
    lead alloys
    integrated circuit technology
    fracture toughness
    hybrid integrated circuits
    X-ray chemical analysis
    X-ray diffraction examination of materials
    chemical interdiffusion
    electron microscope examination of materials
    Abstract: Intermetallic compound formation between thick-film mixed bonded conductor and Sn/Pb solder is investigated. Microstructural evolution of the interfacial morphology, and elemental and phase distribution are probed with the aid of electron microscopy and X-ray diffraction. A decrease in adhesion strength occurs when the sample is aged at 130°C for long periods for time. Microstructural analysis reveals the formation of intermetallic compounds Pd3Sn, Pd2Sn, Pd3Sn2, PdSn, Pd3Pb, Ag5Sn, and Ag3Sn. A possible mechanism of adhesion loss for the conductor is described. In the initial stage, the fracture interface is located where the Pd3Pb exists, which is near the solder. However, the fracture takes place within the solder after aging. It is argued that volume change of the conductor film resulting from the intermetallic formation and incoherency between the compounds due to grain growth are major factors in the degradation of the peel strength
    URI: http://www.ieee.org/
    Appears in Collections:[材料科學工程學系] 期刊論文

    Files in This Item:

    File Description SizeFormat
    2020323010133.pdf569KbAdobe PDF409View/Open


    SFX Query


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback