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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Adhesion strength and microstructural evaluation in electrolessNi-P metallized AlN substrate


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/53051


    Title: Adhesion strength and microstructural evaluation in electrolessNi-P metallized AlN substrate
    Authors: Chung-Daw Young;Jenq-Gong Duh
    教師: 杜正恭
    Date: 1997
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE Transactions on , Volume: 20 Issue:3 , pp.342 - 354
    Keywords: Adhesion
    electroless plating
    fracture crack
    interlocking
    Abstract: The adhesion strength of the electroless Ni (EN)-plated AlN substrates is studied through investigation of the microstructural morphologies at the AlN-EN interfaces. Etching sites around the Al-Y-O compounds on the etched AlN substrate provide the anchor acceptors for interlocking the EN film to achieve a high adhesion strength. Separation of the EN film from the AlN substrate under the action of force leaves the fracture cracks propagating along the AlN/EN interface, cutting through the anchors and making the fragmental EN films around the etching sites reside on the AlN fracture surface. However, the polished AlN substrate lacks the interlocking sites and fails to obstruct the cracks propagating along the AlN/EN interface, and thus results in a poor adhesion strength. An appropriate adhesion strength of 13.7 MPa with a small standard deviation (±2.3 MPa) can be obtained for the previously etched and 10 μm thick EN-plated AlN substrate
    URI: http://www.ieee.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/53051
    Appears in Collections:[材料科學工程學系] 期刊論文

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