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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip chip solder bumps

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/53151

    Title: Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip chip solder bumps
    Authors: Chien-Sheng Huang;Jenq-Gong Duh
    教師: 杜正恭
    Date: 2003
    Publisher: Materials Research Society
    Relation: Journal of Materials Research, 18[4] (2003) pp.935-940.
    Keywords: UBM
    Abstract: Ni-based under-bump metallization (UBM) for flip-chip application is widely used in today's electronics packaging. In this study, electroplated Ni UBM with different thickness was used to evaluate the interfacial reaction during multiple reflow between Ni/Cu UBM and eutectic Sn-Pb solders in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. During the first cycle of reflow, Cu atoms diffused through electroplated Ni and formed the intermetallic compound (IMC) (Ni1-x,Cux)3Sn4. After more than three times of reflow, Cu atoms further diffused through the boundaries of (Ni1-x,Cux)3Sn4 IMC and reacted with Ni and Sn to form another IMC of (Cu1-y,Niy)6Sn5. After detailed quantitative analysis by electron probe microanalysis, the values of y were evaluated to remain around 0.4; however, the values of x varied from 0.02 to 0.35. The elemental distribution of IMC in the interface of the joint assembly could be correlated to the Ni-Cu-Sn ternary equilibrium. In addition, the mechanism of (Cu1-y,Niy)6Sn5 formation was also probed.
    URI: http://www.mrs.org/
    Appears in Collections:[材料科學工程學系] 期刊論文

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