English  |  正體中文  |  简体中文  |  Items with full text/Total items : 54367/62174 (87%)
Visitors : 13873485      Online Users : 56
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  5-nm-thick TaSiC amorphous films stable up to 750 degrees C as a diffusion barrier for copper metallization


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/53222


    Title: 5-nm-thick TaSiC amorphous films stable up to 750 degrees C as a diffusion barrier for copper metallization
    Authors: Lin, Ting-Yi;Cheng, Huai-Yu;Chin, Tsung-Shune;Chiu, Chin-Fu;Fang, Jau-Shiung
    教師: 金重勳
    Date: 2007
    Publisher: American Institute of Physics
    Relation: APPLIED PHYSICS LETTERS,Volume: 91,Issue: 15,Article Number: 152908,Published: OCT 8 2007
    Keywords: TA-N FILMS
    FAILURE-MECHANISM
    CU METALLIZATION
    Abstract: Ultrathin TaSiC amorphous films prepared by magnetron cosputtering using TaSi2 and C targets on Si(100), in a sandwiched scheme Si(100)/TaSiC(5 nm)/Cu, were evaluated for barrier performance in copper metallization. Optimizing carbon content maximizes thermal stability of the films as depicted by sheet-resistance, x-ray diffraction, and transmission electron microscopy examination. The stability temperatures of 700 degrees C (24 at. % C) and 750 degrees C (34 at. % C) have been systematically verified and discussed. Since Ta, Si, and C are compatible with integrated circuit (IC) processing, the TaSiC films are readily applicable for sub-65-nm IC production. (C) 2007 American Institute of Physics.
    URI: http://www.aip.org/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/53222
    Appears in Collections:[材料科學工程學系] 期刊論文

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML969View/Open


    在NTHUR中所有的資料項目都受到原著作權保護,僅提供學術研究及教育使用,敬請尊重著作權人之權益。若須利用於商業或營利,請先取得著作權人授權。
    若發現本網站收錄之內容有侵害著作權人權益之情事,請權利人通知本網站管理者(smluo@lib.nthu.edu.tw),管理者將立即採取移除該內容等補救措施。

    SFX Query

    與系統管理員聯絡

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback