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    National Tsing Hua University Institutional Repository > 理學院 > 物理系 > 期刊論文 >  Preparation and characterization of low-k mesoporous silica films


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/55334


    Title: Preparation and characterization of low-k mesoporous silica films
    Authors: Chao, KJ;Liu, PH;Cho, AT;Huang, KY;Lee, YR;Chang, SL
    教師: 張石麟
    Date: 2004
    Publisher: Elsevier
    Relation: Studies in Surface Science and Catalysis, Elsevier, Volume 154, Part 1, 2004, Pages 94-101
    Keywords: ULTRALOW DIELECTRIC-CONSTANTS
    PORE STRUCTURES
    THIN-FILMS
    HYBRID
    Abstract: Nonionic triblock copolymer P-123 and alkyl poly(oxyethylene) surfactant Brij56 (C16EO10) templated silica films were spin coated on p-type silicon (100) wafers. The dielectric constant, leakage current and mechanical strength were measured and found to be dependent oil the template removal conditions, pore structure and film properties as characterized by TEM, GIXRD, thin film XRD, XRR and N N K analyses of on-wafer samples.
    URI: http://www.elsevier.com/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/55334
    Appears in Collections:[物理系] 期刊論文

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