Nanoimprint lithography offers a low-cost and high-throughput technique for the future manufacturing of semiconductor integrated circuits and other nanodevices. While processing of nanoirnprints has undergone extensive exploration, studies of mechanical failure and reliability issues are sparse. However, both delamination/buckling of imprinted films and fracture of imprinted lines have been identified as the causes for failure in the nanoimprint processes. To understand the factors that result in such damage, stresses are characterized for various steps in nanoimprint processes including molding/demolding, film solidification, and thermomechanical mismatch during cooling. The damage modes are then correlated to the stresses that are generated. The present study identifies factors that result in mechanical failure in nanoimprint processes.