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    National Tsing Hua University Institutional Repository > 工學院  > 材料科學工程學系 > 期刊論文 >  Analyses of mechanical failure in nanoimprint processes


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/62271


    Title: Analyses of mechanical failure in nanoimprint processes
    Authors: Hsueh CH;Lee S;Lin HY;Chen LS;Wang WH
    教師: 李三保
    Date: 2006
    Publisher: Elsevier
    Relation: Materials
    Science and Engineering A 433, 316-322 (2006).
    Keywords: THIN POLYMER-FILMS
    IMPRINT LITHOGRAPHY
    ROOM-TEMPERATURE
    FILM/SUBSTRATE SYSTEMS
    DEFECT ANALYSIS
    FLOW BEHAVIOR
    LOW-PRESSURE
    FABRICATION
    TRANSISTORS
    STRESSES
    Abstract: Nanoimprint lithography offers a low-cost and high-throughput technique for the future manufacturing of semiconductor integrated circuits and other nanodevices. While processing of nanoirnprints has undergone extensive exploration, studies of mechanical failure and reliability issues are sparse. However, both delamination/buckling of imprinted films and fracture of imprinted lines have been identified as the causes for failure in the nanoimprint processes. To understand the factors that result in such damage, stresses are characterized for various steps in nanoimprint processes including molding/demolding, film solidification, and thermomechanical mismatch during cooling. The damage modes are then correlated to the stresses that are generated. The present study identifies factors that result in mechanical failure in nanoimprint processes.
    URI: http://www.elsevier.com/
    http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/62271
    Appears in Collections:[材料科學工程學系] 期刊論文

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