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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 資訊工程學系 > 會議論文  >  Optical PCB inspection system based on Hausdorff distance

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/67208

    Title: Optical PCB inspection system based on Hausdorff distance
    Authors: Chun-Jen Chen;Shang-Hong Lai;Shao-Wei Liu;Terry Ku;Spring Y. Yeh
    教師: 賴尚宏
    Date: 2005
    Publisher: International Society for Optical Engineering
    Relation: Proc. SPIE,Vol. 5679,53,2005
    Keywords: image alignment
    defect detection
    Hausdorff distance
    PCB inspection
    Abstract: In this paper, we propose a coarse-to-fine image comparison algorithm based on Hausdorff distance for PCB inspection. The Hausdorff distance can be used in a geometrics-based inspection framework for comparing binary edge maps extracted from the inspection images. To use the Hausdorff distance for image alignment, we need to compute the edge map from the input image as the first step. In some cases, one may use directed Hausdorff distance as a similarity measure in order to reduce the computational cost during the image alignment. Moreover, a modified version of directed Hausdorff distance is employed to enforce robustness against random noises introduced by edge detection. The search for the optimal alignment by minimizing the associated Hausdorff distance is accomplished by an efficient multi-resolutional downhill simplex search algorithm. In addition to the image alignment, we also apply a modified Hausdorff distance to detect defects in PCB. In our inspection system, we apply the partial Hausdorff distance in a local circuit window to reduce the inspection area dramatically, thus making it very efficient for PCB inspection. Experimental results on some PCB inspection examples are shown to demonstrate the accuracy and efficiency of the proposed Hausdorff-distance based inspection system.
    URI: http://spie.org/
    Appears in Collections:[資訊工程學系] 會議論文

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