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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 會議論文  >  A novel technique for integrated RF-MEMS system-on-chip

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/69969

    Title: A novel technique for integrated RF-MEMS system-on-chip
    Authors: Henry J. H. Chen;Chuen-Uan Huang;Kuo Yu Tseng;Hsu Chun Chen;S.S. Wang;Ruey- Shing Huang
    教師: 黃瑞星
    Date: 2004
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: Proceedings of IEEE Sensors, Vienna University of technology, Vienna, Austria, October, 24-27, 2004, Volume 2, Pages 615-618
    Keywords: RF-MEMS
    Abstract: We present a novel platform technology, EPIES (electroplating and isotropic etching silicon), for integrated RF-MEMS system-on-chip. Thick Cu structures were deposited by electroplating and released by using XeF2 isotropic Si etching to remove Si underneath the plated structures. The driving voltage of demonstrated Cu relay/switch is confirmed by HFSS simulation. This platform technology is simple and easy to use, IC process compatible, and suitable for the integrated RF-MEMS-SoC.
    Relation Link: http://www.ieee.org/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/69969
    Appears in Collections:[電機工程學系] 會議論文

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