English  |  正體中文  |  简体中文  |  Items with full text/Total items : 54367/62174 (87%)
Visitors : 13876071      Online Users : 47
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTHU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 期刊論文 >  Fabrication and Characterization of a Three- Dimensional Flexible Thermopile


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/72704


    Title: Fabrication and Characterization of a Three- Dimensional Flexible Thermopile
    Authors: Puru Lin;Ching-Yi Wu;Yung-Ming Cheng;Yuh-Jiuan Lin;Fon-Shan Huang;Star Ruey-Shing Huang
    教師: 葉鳳生
    Date: 2008
    Publisher: Japan Society of Applied Physics
    Relation: JAPANESE JOURNAL OF APPLIED PHYSICS, Japan Society of Applied Physics, Volume 47, Issue 3, 2008, Pages 1787-1793
    Keywords: thermopile
    flexible
    polyimide
    wet-etching
    Abstract: This paper presents the fabrication and characterization of a three-dimensional (3D) thermopile; consists of 71 Cu–Ni series-connected thermocouples on polyimide (PI) flexible substrate. Using wet etching to etch through 25 μm PI, the cold and hot junctions of thermocouples are formed on the top and bottom surfaces of PI substrate. This 3D layout design differentiates its innovative uniqueness from the traditional 2D planar thermopiles that have both hot and cold junctions on the same plane. The experimental studies on the PI etching with respect to the concentrations of KOH and C2H7NO in the etching solution conclude that the optimal composition of the etchant is 7–9 M KOH with 2–4 M C2H7NO and etched at 80 °C. A measured sensitivity of 0.44 mV/K is realized in the fabricated device. The temperatures measured by the 3D thermopile are very close to those obtained with a digital thermometer, demonstrating that 3D flexible thermopiles has great potential to provide low cost thermal sensor.
    Relation Link: http://www.jsap.or.jp/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/72704
    Appears in Collections:[電機工程學系] 期刊論文

    Files in This Item:

    There are no files associated with this item.



    在NTHUR中所有的資料項目都受到原著作權保護,僅提供學術研究及教育使用,敬請尊重著作權人之權益。若須利用於商業或營利,請先取得著作權人授權。
    若發現本網站收錄之內容有侵害著作權人權益之情事,請權利人通知本網站管理者(smluo@lib.nthu.edu.tw),管理者將立即採取移除該內容等補救措施。

    SFX Query

    與系統管理員聯絡

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback