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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 期刊論文 >  Low Propagation Delay Load-Balanced 4x4 Switch Fabric IC in 0.13-/spl mu/m CMOS Technology


    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83469


    Title: Low Propagation Delay Load-Balanced 4x4 Switch Fabric IC in 0.13-/spl mu/m CMOS Technology
    Authors: C.T. Chiu;Y.-H. Hsu;W.-C. Lai;J.-M. Wu;S. H. Hsu;Y.-S. Lin;F.-T. Chen;M.- S. Kao;Y.S. Hsu
    教師: 吳仁銘
    Date: 2013
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: IEEE Transactions on VLSI Systems, Institute of Electrical and Electronics Engineers, 2013, Mar
    Keywords: IC
    CMOS
    Abstract: A load-balanced Birkhoff-von Neumann (LB-BvN) 4 × 4 switch fabric IC is proposed for feedback-based switch systems. This is fabricated in 0.13- μm CMOS technology and the chip area is 1.380 × 1.080 mm2. The overall data rate of the LB-BvN 4 × 4 switch fabric IC is up to 32 Gb/s (8 Gb/s/channel) with only 0.8 ns propagation delay. The LB-BvN switch is highly recommended for constructing the next-generation terabit switch. In a feedback-based switch system, the long propagation delay of the switch module reduces the system throughput significantly. In this paper, we present a scalable LB-BvN 4 × 4 switch fabric IC directly in the high-speed domain. By observing the deterministic switching pattern of the N×N LB-BvN switch, we present a low-complexity pattern generator that reduces the PG complexity from O(N3) to O(1). This technique reduces the propagation delay of the switch module from 30 to 0.8 ns, and also provides 80% area saving and 85% power saving compared to serializer-deserializer interfaces. The proposed LB-BvN 4 × 4 switch fabric IC is suitable for feedback-based switch systems to solve the throughput degradation problem.
    Relation Link: http://www.ieee.org/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83469
    Appears in Collections:[電機工程學系] 期刊論文
    [積體電路設計技術研發中心] 期刊論文
    [通訊工程研究所] 期刊論文

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