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    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83910

    Title: Is 3D integration the way out of the crossroads?
    Authors: D.-M. Kwai;Y.-F. Chou;C.-W. Wu
    教師: 吳誠文
    Date: 2010
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: Proc. IEEE Asian Solid-State Circuits Conf. (A-SSCC), Beijing, 8-10 Nov. 2010, Pages 1-4
    Keywords: 3D
    Abstract: In the past few years, we have witnessed the energy crisis and the financial tsunami that played an unwanted duo, changing the world in many aspects that affect most of us. Like many others, the semiconductor industry is trying to recover from the depression triggered by the duo. While companies are working hard in getting out of the slump, many research organizations are rethinking how their R&D budget should be invested. We consider three-dimensional (3D) integration based on the through-silicon-via (TSV) technology a cost-effective way to explore new applications in the future, alleviating the fast growing development cost of system-on-chip (SOC) products. However, there are technical problems to be solved and business models to be established before the industry is ready for manufacturing TSV-based 3D integrated devices. In this paper, we will first give an overview of the status of the worldwide semiconductor industry, identifying challenges and trends, which somewhat justifies our focus on 3D integration. We will then discuss the design and test issues, and some solutions for 3D integrated devices. We will propose approaches from our work at ITRI and NTHU.
    Relation Link: http://www.ieee.org/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83910
    Appears in Collections:[電機工程學系] 會議論文
    [電腦與通訊科技研發中心] 會議論文
    [資訊工程學系] 會議論文

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