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    National Tsing Hua University Institutional Repository > 電機資訊學院 > 電機工程學系 > 會議論文  >  DfT architecture for 3D-SICs with multiple towers

    Please use this identifier to cite or link to this item: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83915

    Title: DfT architecture for 3D-SICs with multiple towers
    Authors: C.-C. Chi;E. J. Marinissen;S. K. Goel;C.-W. Wu
    教師: 吳誠文
    Date: 2011
    Publisher: Institute of Electrical and Electronics Engineers
    Relation: 16th IEEE European Test Symposium (ETS), Trondheim, NORWAY, MAY 23-27, 2011
    3-D ICS
    Abstract: Three-dimensional stacked ICs (3D-SICs) based on Through-Silicon Vias (TSVs) provide attractive benefits such as smaller form factor, higher performance, and lower power. So far, prior work on Design-for-Testability (DfT) only focused on 3D-SICs consisting of a single "tower", i.e., a 3D-SIC in which each stack level contains exactly one die. 3D stacking technology allows to place multiple dies on top of a common base die, resulting in 3D-SICs with multiple "towers". This paper presents a generic DfT architecture for 3D-SICs having any number of "towers", possibly including "sub-towers". We also present efficient test control mechanisms. Experimental results show that the proposed architecture has a negligible area cost for medium-sized and larger industrial designs, and therefore provides a cost-effective test solution for 3D-SICs.
    Relation Link: http://www.ieee.org/
    URI: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/83915
    Appears in Collections:[電機工程學系] 會議論文
    [電腦與通訊科技研發中心] 會議論文
    [資訊工程學系] 會議論文

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